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PCB Depaneling Router
PCB Sawing System
LASER Cutting Machine
Auto Tray Unloading System
BGA Grinding System
Line Monitoring System (LMS)
Automobile Assembly Line
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제품소개
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LASER Cutting Machine
제품소개
PCB Depaneling Router
PCB Sawing System
LASER Cutting Machine
Auto Tray Unloading System
BGA Grinding System
Line Monitoring System (LMS)
Automobile Assembly Line
바로가기 배너
LS-NUN
Laser Depaneling System
특장점
Use various Laser source as UV, Green, IR, etc.
Cutting materials : FR4, FPCBs, Kapton, etc.
Thickness up to 1.2mm in the case of FR4 PCB
Pin Table, Production fixture
Full-cut process, Support high populated PCB panel
Best cutting quality(Minimize charring)
Clean process of particle and fume removal
옵션
Easy setup of BDS(Beam Delivery System)
Automated Laser power management
Apply the optimized optic system
Incredible cost performance using 2 Table
Full graphic interface and easy programming
Real-time monitoring of key process parameters
특장점 및 옵션
제원
동영상
특장점
옵션
제원(Standard)
Layout
동영상
목록
PCB Depaneling Router
Full Automatic In-Line Router
iDPL-S (Single)
iDPL-T (Twin)
iDPL-D (Dual)
iDPL-U (Undercut)
iDPL-ST (Single Tray)
Stand-Alone Off-Line Router
nDPL-T (Twin)
nDPL-S (Single)
PCB Sawing System
Stand-Alone Off-Line Sawing
nDPL-TW (Twin)
nDPL-SW (Single)
Full Automatic In-Line Sawing
LASER Cutting Machine
LS-NUN
Auto Tray Unloading System
Auto Tray Function
BGA Grinding System
eDPL-SG
Dust Collecting System
Tornado
Line Monitoring System (LMS)
Line Monitoring System (LMS)
Automobile Assembly Line
Automobile Assembly Line
Vision Inspection System
Leak Test System